Advanced Thermal Design Of Electronic Equipment
by Ralph Remsburg /
2012 / English / PDF
24.2 MB Download
The field of electronic packaging continues to grow at an amazing
rate. To be successful in this field requires analytical skills, a
foundation in mechanical engineering, and access to the latest
developments in the electronics field. The emphasis for each
project that the electronic packaging engineer faces changes from
project to project, and from company to company, yet some constants
should continue into the foreseeable future. One of these is the
emphasis on ther mal design. Although just a few years ago thermal
analysis of electronic equipment was an afterthought, it is
becoming one of the primary aspects of many packaging jobs. It
seems that the days of just adding a bigger fan to reduce the
overheat ing problem are almost over. Replacing that thought is
the up-front commitment to CFD (Computational Fluid Dynamics)
software code, FEA (Finite Element Analysis) software, and the
realization that the problem will only get worse. As the electronic
circuit size is reduced, speed is increased. As the power of these
systems increases and the volume allowed diminishes, heat flux or
density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much
of the improvement in the reliability and packaging density of
electronic circuits can be traced to advances in thermal design.
While air cooling is still used extensively, advanced heat transfer
techniques using exotic synthetic liquids are becoming more
prominent, allowing still smaller systems to be manufactured. The
appli cation of advanced thermal management techniques requires a
background in fluid dynamics.
The field of electronic packaging continues to grow at an amazing
rate. To be successful in this field requires analytical skills, a
foundation in mechanical engineering, and access to the latest
developments in the electronics field. The emphasis for each
project that the electronic packaging engineer faces changes from
project to project, and from company to company, yet some constants
should continue into the foreseeable future. One of these is the
emphasis on ther mal design. Although just a few years ago thermal
analysis of electronic equipment was an afterthought, it is
becoming one of the primary aspects of many packaging jobs. It
seems that the days of just adding a bigger fan to reduce the
overheat ing problem are almost over. Replacing that thought is
the up-front commitment to CFD (Computational Fluid Dynamics)
software code, FEA (Finite Element Analysis) software, and the
realization that the problem will only get worse. As the electronic
circuit size is reduced, speed is increased. As the power of these
systems increases and the volume allowed diminishes, heat flux or
density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much
of the improvement in the reliability and packaging density of
electronic circuits can be traced to advances in thermal design.
While air cooling is still used extensively, advanced heat transfer
techniques using exotic synthetic liquids are becoming more
prominent, allowing still smaller systems to be manufactured. The
appli cation of advanced thermal management techniques requires a
background in fluid dynamics.